Electronics design
- Analogue and power electronics
- High-frequency output stages
- Schematic capture and multi-layer PCB layout
- Component selection and sourcing
Capabilities
What we can actually make.
Listed by discipline. Where something is subcontracted rather than done on our own bench, we say so.
Embedded firmware
- Bare-metal and RTOS firmware
- Front panel and interface logic
- Sensor interfacing — I²C, SPI, UART, ADC
- Cellular, Wi-Fi and Bluetooth connectivity
Power conversion
- Custom transformer specification and winding
- Supply and regulation design
- Thermal design and derating
- Winding for prototype and small-batch builds
Mechanical
- Enclosure and front panel design
- Sheet metal and moulded part specification
- Assembly design and fixturing
- Fit and tolerance between board, panel and case
Aerial systems
- Airframe design to payload and endurance
- Propulsion and power budgeting
- Flight control integration and tuning
- Payload integration and flight testing
Test and validation
- Functional test rig design
- High-g and vibration instrumentation
- Signal capture and waveform validation
- Batch functional testing
Manufacturing
- Assembly and wiring
- Final integration and burn-in
- Packaging and finished goods
- Volume PCB assembly placed with subcontractors
Boundaries
What we do not do.
Saying this plainly costs us enquiries we would have lost anyway, two months later, after wasting your time.
- Hold device registrations or act as legal manufacturer of record
- Issue certification of any kind — we hold none today
- Clinical trials, evaluation or regulatory submission writing
- High-volume consumer electronics runs
Is what you need on this page?
If it is, tell us the specifics. If it is nearly on this page, ask anyway — the boundary moves for the right project.